TI 950 TriboIndenter®

Nanomechanical test instrument

The TI 950 TriboIndenter is the next generation nanomechanical test instrument providing industry leading sensitivity and unprecedented performance. The TI 950 has been developed as an automated, high throughput instrument to support the numerous nanomechanical characterization techniques developed by Hysitron.

The system incorporates the newly developed performechTM advanced control module, which greatly improves the precision of feedback-controlled nanomechanical testing, provides dual head testing capability for nano–micro scale connectivity, and offers unprecedented noise-floor performance. The numerous nanomechanical testing techniques currently offered, as well as new testing methods currently being developed, make the TI 950 system an exceptionally versatile and effective nanomechanical characterization tool for the broadest range of applications.

Datasheet - TI 950 TriboIndenter (327 downloads)


    • Hysitron’s patented capacitive transducer provides industry leading sensitivity and stability
    • Hysitron’s performechTM advanced control module with performance leading force and displacement feedback control algorithms with a 78 kHz feedback loop rate and user definable data acquisition rates up to 30 kHz for superior control over all nanomechanical testing techniques
    • Dual head testing capability providing an available force range from ≤30 nN to 10 N for true nano–micro scale connectivity
    • Conforms to ISO 14577 with temperature and humidity measurement
    • Automated testing for high throughput and statistical sampling of materials
    • In-situ imaging provides nanometer precision test positioning and the convenience of SPM topography
    • Engineered acoustic and thermal enclosure, along with a stable transducer design and active vibration dampening, minimizes test set-up and stabilization time
    • Top-down, high resolution color optics for viewing and selection of testing sites

500nm resolution staging for precise sample positioning

  • Numerous add-ons that provide the widest array of testing capabilities on the market


Five Low Force Indentation Tests on (100) Si – A series of five low force indents on (100) Silicon showing the industry leading noise-floor performance and data repeatability of the TI 950 nanomechanical testing system.

Unmatched performance in nanomechanical characterization.

The TI 950 combines Hysitron’s patented three plate capacitive transducer* technology with state-of-the-art control technology to achieve unmatched performance in nanomechanical characterization. The system features a sub 30 nN force noise floor, ultra-fast feedback control, user-definable data acquisition rates up to 30 kHz, the widest range of nanomechanical testing techniques, and the ability to test with various Hysitron heads seamlessly.

The superior staging system on the TI 950, along with the in-situ Scanning Probe Microscopy (SPM) imaging capability, provides unparalleled precision in test-placement accuracy and data repeatability.

Superior Control

The combination of Hysitron’s performance-leading feedback control algorithms and superior measurement sensitivity provides precise control for all Hysitron nanomechanical testing techniques. All feedback control functionalities on the TI 950 are carried out by a dedicated digital-signal processor (DSP) and field-programmable gate array (FPGA) embedded control system to accurately follow the inputted request of the user.

The internal feedback loop rate of 78 kHz assures that the requested load/displacement function tracks even the fastest transient events that may occur during the indentation process. Additionally, the fast control loop provides the ability to capture data precisely at user-definable data acquisition rates up to 30 kHz. The TI 950 operates in both load and displacement control, allowing the operator to perform nanoscale creep and stress relaxation studies with superior control over tip-sample contact conditions.

Load-controlled nanoindentation test on single crystal (100) Al showing dislocation activity throughout the testing cycle

TI 950 TriboIndenter configured for seamless operation between Hysitron’s capacitive transducer, 3D OmniProbe, and high-resolution optics.

Dual Head Capability

The TI 950 provides the ability to incorporate Hysitron’s capacitive transducer technology, renowned for its industry- leading sensitivity, with a higher load head (3D OmniProbeTM or MultiRange NanoprobeTM). This provides seamless nanometer- micrometer scale connectivity. This unique combination of heads provides the broadest force range available for nanomechanical testing (≤30 nN to 10 N) and is specifically designed to accomodate the widest range of applications.

In-situ SPM Imaging

Hysitron offers in-situ scanning probe microscopy (SPM) imaging as standard with each nanomechanical testing instrument. The in-situ SPM imaging capability of the TI 950 TriboIndenter is critical for precise test placement and microstructure identification. The in-situ images are obtained by raster scanning the indenter probe over the sample surface to allow for pre- and post-test observation of the material surface.
This feature provides the exclusive capability to position the indenter probe within ten nanometers of the desired testing location. Identification and characterization of individual phases in multi-phase materials or fine sample surface features can only be reliably carried out by employing Hysitron’s patented in-situ SPM imaging.

Post-test imaging also provides the ability to verify that the test was performed in the desired location. This maximizes the reliability of data and aids in the explanation of unexpected test results.
The TI 950 offers quantitative topographical imaging with an extremely low imaging contact force (≤70 nN). This is particularly well suited for soft material and delicate structure characterization. Quantification of material deformation behavior is necessary for many analyses that have been derived for nanoindentation and nanoscratch testing results.

In-situ SPM imaging allows observation and quantification of material deformation, such as pile-up, wear volume, crack length and scratch morphology, incurred during testing. A versatile software package has been developed that allows for automated testing on site-specific sample locations identified through in-situ imaging. The software package also includes real-time and off-line image processing and analysis tools designed by scientists for the quantification of deformation incurred during testing.

Image showing a residual high-load indent impression with low-load indentation tests placed along the pile-up.