SEM Mill – Model 1060
A state-of-the-art ion milling and polishing system. It is compact, precise, and consistently produces high-quality scanning electron microscopy (SEM) samples for a wide variety of applications.
- Two independently adjustable TrueFocus ion sources
- High energy operation for rapid milling; low energy operation for sample polishing
- Adjustable beam diameters
- Simple setup of milling parameters
- Individual, automatic ion source gas control
- Continuously adjustable milling angle range of 0 to +10 ̊
- Sample rocking or rotation
- Stereo microscope for direct sample observation
- High-magnification microscope and CCD camera
- Basic and premium editions available (basic edition shown at left)
Ion milling is used in the physical sciences to enhance the sample’s surface characteristics. Inert gas, typically argon, is ionized and then accelerated toward the sample surface. By means of momentum transfer, the impinging ions sputter material from the sample at a controlled rate.
Advanced sample preparation
For many of today’s advanced materials, analysis by SEM is an ideal technique for rapidly studying material structure and properties. Fischione Model 1060 SEM Mill is an excellent tool for creating the sample surface characteristics needed for SEM imaging and analysis.
Two ion sources
Two TrueFocus ion sources direct controlled- diameter ion beams to the surface of the sample. Beam diameter is user adjustable. Both sources are concentrated on the sample surface for high milling rates. The ion sources are physically small and require minimal gas but deliver a large range of ion beam energies.
When operated in the upper energy range, milling is rapid, even at low angles. When operated at low energy, material is gradually sputtered from the sample without inducing artifacts.
The unique design of the TrueFocus ion source allows for a controlled ion beam diameter, which means the ions are directed only to the sample and sputtered material is not redeposited from the sample holder and/or chamber onto the sample surface.
Ion accelerating voltages are programmable and can be continuously varied from as high as 6.0 keV for rapid milling to as low as 100 eV for final sample polishing. Ion beam currents can be established from hundreds of nanoamperes to tens of microamperes.
The SEM Mill is equipped with Faraday cups for measuring ion beam current.
The ion sources are visually aligned from outside the vacuum using a luminescent target.
Automatic gas control
Two mass-flow controllers provide independent and automatic regulation of process gas for the ion sources. The gas control algorithm produces stable ion beams over a wide variety of ion source milling parameters.
Fully integrated dry vacuum system
The fully integrated vacuum system includes a turbomolecular drag pump backed by a multi-stage diaphragm pump. This oil-free system assures a clean environment for sample processing. Because the gas requirements of the TrueFocus ion source are small, the 70 ops turbomolecular drag pump produces an operating system vacuum of approximately 5×10-4 mbar. The vacuum level is measured with a Pirani gauge and is continuously indicated.
Sample mounting and positioning
The SEM Mill accommodates a wide range of sample sizes and configurations for applications such as bulk milling, electron backscatter diffraction (EBSD), semiconductor preparation, as well as traditional slope cutting and cross- sectional polishing.
A series of sample holders are available for a multitude of applications. Loading stations further facilitate the sample handling process.
The SEM Mill’s vacuum chamber remains under continuous vacuum during operation. A load lock isolates the high chamber vacuum from ambient during sample exchange, ensuring optimal vacuum conditions. The small chamber size makes it easy to clean during periodic maintenance.
Quick sample transfer
The SEM Mill’s vacuum chamber remains under continuous vacuum during operation.
A load lock isolates the high chamber vacuum from ambient during sample exchange, ensuring optimal vacuum conditions. The small chamber size makes it easy to clean during periodic maintenance.
Cold trap (optional)
The SEM Mill is available with an optional
cold trap that is highly effective in removing hydrocarbons and water vapor therefore improving the chamber vacuum quality. The cold trap features a dewar located within the enclosure.
Precise angle adjustment
With the sample stage fixed in position, the ion sources are tilted to provide the desired milling angle. Tilt angles are continuously adjustable in the range from 0 to +10 ̊. Ion beam impingement angles are independently adjustable for each ion source.
Ion milling with low angles of incidence (less than 10 ̊), combined with low-energy ion source operation, minimizes irradiation damage and sample heating. Because it facilitates the uniform thinning of dissimilar materials, low-angle milling is highly beneficial when preparing layered or composite materials as well as cross- sectional SEM samples.
|Ion source||Two TrueFocus ion sources
Variable energy (100 eV to 6.0 keV) operation
Beam current density up to 10 mA/cm2
Choice of single or dual ion source operation
Independent ion source energy control (premium edition option)
|Specimen stage||Milling angle range of 0 to +10 ̊
Sample size of 1 in diam x 0.59 in height (25 mm diam x 15 mm height)
Automatic height sensing 360 ̊ sample rotation Specimen rocking
|Specimen cooling (optional)||Liquid nitrogen conductive cooling with integral dewar and automatic temperature interlocks|
|Vacuum system||+Turbomolecular drag pump and an oil-free diaphragm pump Vacuum sensing with a Pirani gauge|
|Process gas||Argon, 99.999% purity
Flow rate approximately 0.2 sccm/ion source, nominal 15 psi delivery pressure required
Automatic gas control using two mass flow controllers
|Pneumatic supply||Argon, liquid nitrogen, or dry air; nominal 60 psi delivery pressure required|
|Specimen illumination||Independently actuated transmitted and reflected lights|
|Automatic termination||Automatic termination by timer|
|User interface||Basic edition
Touch screen-embedded module for primary-level instrument functionality
|Microscope (optional)||Load lock window accommodates a 7-45 X stereo microscope attachment for direct specimen observation and a 2,000 X high-magnification microscope and camera system for site specific image acquisition and display|
27 in (69 cm) width x 15 in (38 cm) height (to top of cabinet) x 29 in (74 cm) height (to top of microscope) x 20 in (51 cm) depth
42 in (107 cm) width (including computer display) x 15 in (38 cm) height (to top of cabinet) x 29 in (74 cm) height (to top of microscope) x 20 in (51 cm) depth
|Weight||161 lb (73 kg)|
|Power||100/120/220/240 VAC, 50/60 Hz, 720 W|
Semiconductor sample preparation for scanning electron microscopy (126 téléchargements)
Microelectronic device delayering using an adjustable broad‐beam ion source (294 téléchargements)
Shale plan view sample preparation for scanning electron microscopy (115 téléchargements)
Metal plan view sample preparation for electron backscatter diffraction analysis (125 téléchargements)
Preparation of a copper plate sample for scanning electron microscopy (109 téléchargements)
Preparing cross sections of materials with very different mechanical properties (111 téléchargements)
Metallic sample preparation for EBSD by mechanical method and argon ion beam milling (129 téléchargements)